Items 2010 2013
Trace Width/Space 3mil/3mil 1.6mil/1.6mil
Trace Width Tolerance ±0.02mm ±0.01mm
Distance between Pad and Conductor 0.1mm 0.075mm
Distance between Board Edge and Conductor 0.15mm 0.15mm
Min. Pad Size 0.3x0.3mm 0.3x0.3mm
PTH Pad Size 0.45mm 0.25mm
Min. PTH Aperture 0.2mm 0.1mm
Registration of Silk-Screen ±0.2mm ±0.075mm
Tolerance of External Dimension ±0.05mm ±0.05mm
Tolerance of Aperture/Registration of Hole ±0.05mm ±0.025mm
Thickness of Ni Plating 1μm-5μm 1μm-5μm
Thickness of Au Plating 0.05μm-0.2μm 0.05μm-0.2μm
Maximum Layer 8层 8层



项目 量产能力
Chip器件 可加工最小尺寸电阻、电容电感 0201
SMT加工直通率 99.95%
连接器 可加工最小Pitch 连接器 0.4mm
SMT加工直通率 99.80%
BGA 可加工最小Pitch BGA器件 0.4mm
SMT加工直通率 99.80%
QFN 可加工最小Pitch QFN器件 0.4mm
SMT加工直通率 99.80%
LED LED灯贴装角度精度 ±1°
SMT加工直通率 99.90%